Publication:
Two-layer silicon hybrids interconnect technology
Date
| dc.contributor.author | Lernout, Jo | |
| dc.contributor.author | Van Calster, Andre | |
| dc.contributor.author | Vereeken, Maria | |
| dc.contributor.author | Schols, G. | |
| dc.contributor.imecauthor | Van Calster, Andre | |
| dc.date.accessioned | 2021-09-29T13:09:08Z | |
| dc.date.available | 2021-09-29T13:09:08Z | |
| dc.date.issued | 1995 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/721 | |
| dc.source.beginpage | 375 | |
| dc.source.conference | Proceedings 1995 International Conference on Multichip Modules; April 1995; Denver, Colorado, USA. | |
| dc.source.conferencelocation | ||
| dc.source.endpage | 380 | |
| dc.title | Two-layer silicon hybrids interconnect technology | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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