Damage reduction and sealing of low-k films by combined He and NH3 plasma treatment

dc.contributor.author	Urbanowicz, Adam
dc.contributor.author	Baklanov, Mikhaïl
dc.contributor.author	Heijlen, Jeroen
dc.contributor.author	Travaly, Youssef
dc.contributor.author	Cockburn, Andrew
dc.contributor.imecauthor	Heijlen, Jeroen
dc.contributor.imecauthor	Cockburn, Andrew
dc.date.accessioned	2021-10-16T20:21:51Z
dc.date.available	2021-10-16T20:21:51Z
dc.date.embargo	9999-12-31
dc.date.issued	2007
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/13005
dc.source.beginpage	G76
dc.source.endpage	G79
dc.source.issue	10
dc.source.journal	Electrochemical and Solid-State Letters
dc.source.volume	10
dc.title	Damage reduction and sealing of low-k films by combined He and NH3 plasma treatment
dc.type	Journal article
dspace.entity.type	Publication
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