Publication:
Cu TSV stress: avoiding Cu protrusion and impact on devices
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | De Messemaeker, Joke | |
| dc.contributor.author | Guo, Wei | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | De Messemaeker, Joke | |
| dc.contributor.imecauthor | Guo, Wei | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-22T00:46:34Z | |
| dc.date.available | 2021-10-22T00:46:34Z | |
| dc.date.issued | 2014 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/23547 | |
| dc.identifier.url | http://onlinelibrary.wiley.com/doi/10.1002/9783527670109.ch27/summary | |
| dc.source.beginpage | 365 | |
| dc.source.book | Handbook of 3D Integration, Volume 3: 3D Process Integration | |
| dc.source.endpage | 378 | |
| dc.title | Cu TSV stress: avoiding Cu protrusion and impact on devices | |
| dc.type | Book chapter | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |