Publication:
Electroless Cu deposition on self-assembled monolayer alternative barriers
Date
| dc.contributor.author | Armini, Silvia | |
| dc.contributor.author | Maestre Caro, Arantxa | |
| dc.contributor.imecauthor | Armini, Silvia | |
| dc.contributor.orcidimec | Armini, Silvia::0000-0003-0578-3422 | |
| dc.date.accessioned | 2021-10-17T21:18:06Z | |
| dc.date.available | 2021-10-17T21:18:06Z | |
| dc.date.issued | 2009 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14907 | |
| dc.source.beginpage | 1156-D04-08 | |
| dc.source.conference | Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics | |
| dc.source.conferencedate | 13/04/2009 | |
| dc.source.conferencelocation | San Francisco, CA USA | |
| dc.title | Electroless Cu deposition on self-assembled monolayer alternative barriers | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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