Publication:
Raman spectroscopy study of stress in 3D-stacked chips and correlation with FEM and electrical measurements
Date
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.author | Simons, Veerle | |
| dc.contributor.author | Lofrano, Melina | |
| dc.contributor.author | Cherman, Vladimir | |
| dc.contributor.author | De Vos, Joeri | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.imecauthor | Simons, Veerle | |
| dc.contributor.imecauthor | Lofrano, Melina | |
| dc.contributor.imecauthor | Cherman, Vladimir | |
| dc.contributor.imecauthor | De Vos, Joeri | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.contributor.orcidimec | Simons, Veerle::0000-0001-5714-955X | |
| dc.contributor.orcidimec | De Vos, Joeri::0000-0002-9332-9336 | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-22T01:11:30Z | |
| dc.date.available | 2021-10-22T01:11:30Z | |
| dc.date.issued | 2014-09 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/23736 | |
| dc.identifier.url | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6962729 | |
| dc.source.beginpage | 978 | |
| dc.source.conference | Electronics System-Integration Technology Conference - ESTC | |
| dc.source.conferencedate | 16/09/2014 | |
| dc.source.conferencelocation | Helsinki Finland | |
| dc.source.endpage | 983 | |
| dc.title | Raman spectroscopy study of stress in 3D-stacked chips and correlation with FEM and electrical measurements | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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