Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects

dc.contributor.author	Nair, Sarath Mohanachandran
dc.contributor.author	Bishnoi, Rajendra
dc.contributor.author	Tahoori, Mehdi B.
dc.contributor.author	Zahedmanesh, Houman
dc.contributor.author	Croes, Kristof
dc.contributor.author	Garello, Kevin
dc.contributor.author	Kar, Gouri Sankar
dc.contributor.author	Catthoor, Francky
dc.contributor.imecauthor	Zahedmanesh, Houman
dc.contributor.imecauthor	Croes, Kristof
dc.contributor.imecauthor	Garello, Kevin
dc.contributor.imecauthor	Kar, Gouri Sankar
dc.contributor.imecauthor	Catthoor, Francky
dc.contributor.orcidimec	Garello, Kevin::0000-0003-0236-322X
dc.contributor.orcidimec	Croes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimec	Catthoor, Francky::0000-0002-3599-8515
dc.date.accessioned	2022-01-20T09:38:33Z
dc.date.available	2021-11-02T16:05:15Z
dc.date.available	2022-01-20T09:38:33Z
dc.date.issued	2020
dc.identifier.eisbn	978-1-7281-3199-3
dc.identifier.issn	1541-7026
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/38200
dc.publisher	IEEE
dc.source.conference	IEEE International Reliability Physics Symposium (IRPS)
dc.source.conferencedate	APR 28-MAY 30, 2020
dc.source.conferencelocation	Dallas, TX, USA
dc.source.journal	na
dc.source.numberofpages	5
dc.title	Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects
dc.type	Proceedings paper
dspace.entity.type	Publication
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