Publication:

Lithography for patterning inside through-Si vias

Date

2007
Proceedings Paper
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dc.contributor.authorPham, Nga
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorMajeed, Bivragh
dc.contributor.authorDe Moor, Piet
dc.contributor.authorBaert, Kris
dc.contributor.authorSwinnen, Bart
dc.contributor.authorRuythooren, Wouter
dc.contributor.imecauthorPham, Nga
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorMajeed, Bivragh
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.date.accessioned2021-10-16T18:36:54Z
dc.date.available2021-10-16T18:36:54Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12701
dc.source.beginpage120
dc.source.conference9th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate10/12/2007
dc.source.conferencelocationSingapore
dc.source.endpage124
dc.title

Lithography for patterning inside through-Si vias

dc.typeProceedings paper
dspace.entity.typePublication
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