Packaging silicon photonics with polymer waveguides for 3D electro-optical integration

dc.contributor.author	Mangal, Nivesh
dc.contributor.author	Missinne, Jeroen
dc.contributor.author	Van Steenberge, Geert
dc.contributor.author	Van Campenhout, Joris
dc.contributor.author	Snyder, Brad
dc.contributor.imecauthor	Mangal, Nivesh
dc.contributor.imecauthor	Missinne, Jeroen
dc.contributor.imecauthor	Van Steenberge, Geert
dc.contributor.imecauthor	Van Campenhout, Joris
dc.contributor.orcidimec	Missinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimec	Van Steenberge, Geert::0000-0001-8574-1235
dc.contributor.orcidimec	Van Campenhout, Joris::0000-0003-0778-2669
dc.date.accessioned	2021-10-24T08:41:26Z
dc.date.available	2021-10-24T08:41:26Z
dc.date.embargo	9999-12-31
dc.date.issued	2017
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/28909
dc.identifier.url	http://ieeexplore.ieee.org/document/8116289/
dc.source.beginpage	707
dc.source.conference	IEEE Photonics Conference - IPC
dc.source.conferencedate	1/10/2017
dc.source.conferencelocation	Lake Buena Vista, FL USA
dc.source.endpage	708
dc.title	Packaging silicon photonics with polymer waveguides for 3D electro-optical integration
dc.type	Proceedings paper
dspace.entity.type	Publication
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