Publication:
Wafer-level package integrated functions
Date
| dc.contributor.author | Carchon, Geert | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-15T12:49:24Z | |
| dc.date.available | 2021-10-15T12:49:24Z | |
| dc.date.issued | 2004-09 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/8655 | |
| dc.source.beginpage | 284 | |
| dc.source.conference | Extended Abstracts International Conference on Solid State Devices and Materials | |
| dc.source.conferencedate | 14/09/2004 | |
| dc.source.conferencelocation | Tokyo Japan | |
| dc.source.endpage | 285 | |
| dc.title | Wafer-level package integrated functions | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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