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imec Publications
Conference contributions
3D SoC integration, beyond 2.5D chiplets
Publication:
3D SoC integration, beyond 2.5D chiplets
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Date
2021
Proceedings Paper
https://doi.org/10.1109/IEDM19574.2021.9720614
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Beyne, Eric
;
Milojevic, Dragomir
;
Van der Plas, Geert
;
Beyer, Gerald
Journal
na
Abstract
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Views
1654
since deposited on 2022-07-09
2
last month
Acq. date: 2026-02-04
Citations