Publication:

Flip-chip bonding of VCSELs to silicon grating couplers via SU8 prisms fabricated using laser ablation

Date

 
dc.contributor.authorKaur, Kamalpreet
dc.contributor.authorSubramanian, Ananth
dc.contributor.authorVerplancke, Rik
dc.contributor.authorCardile, Paolo
dc.contributor.authorVan Kerrebrouck, Joris
dc.contributor.authorSpiga, S.
dc.contributor.authorMeyer, R.
dc.contributor.authorBauwelinck, Johan
dc.contributor.authorBaets, Roel
dc.contributor.authorVan Steenberge, Geert
dc.contributor.imecauthorKaur, Kamalpreet
dc.contributor.imecauthorVerplancke, Rik
dc.contributor.imecauthorVan Kerrebrouck, Joris
dc.contributor.imecauthorBauwelinck, Johan
dc.contributor.imecauthorBaets, Roel
dc.contributor.imecauthorVan Steenberge, Geert
dc.contributor.orcidimecVerplancke, Rik::0000-0002-6642-9454
dc.contributor.orcidimecVan Kerrebrouck, Joris::0000-0002-6611-7979
dc.contributor.orcidimecBauwelinck, Johan::0000-0001-5254-2408
dc.contributor.orcidimecBaets, Roel::0000-0003-1266-1319
dc.contributor.orcidimecVan Steenberge, Geert::0000-0001-8574-1235
dc.date.accessioned2021-10-22T20:03:43Z
dc.date.available2021-10-22T20:03:43Z
dc.date.embargo9999-12-31
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25458
dc.source.conference41st European Conference on Optical Communication - ECOC
dc.source.conferencedate27/09/2015
dc.source.conferencelocationValencia Spain
dc.title

Flip-chip bonding of VCSELs to silicon grating couplers via SU8 prisms fabricated using laser ablation

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
32688.pdf
Size:
357.88 KB
Format:
Adobe Portable Document Format
Publication available in collections: