Publication:

Interconnect metals beyond copper: reliability challenges and opportunities

Date

2018
Proceedings Paper
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dc.contributor.authorCroes, Kristof
dc.contributor.authorAdelmann, Christoph
dc.contributor.authorWilson, Chris
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorWu, Chen
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorOprins, Herman
dc.contributor.authorBeyne, Sofie
dc.contributor.authorCiofi, Ivan
dc.contributor.authorKocaay, Deniz
dc.contributor.authorStucchi, Michele
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorWu, Chen
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorBeyne, Sofie
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.contributor.orcidimecWu, Chen::0000-0002-4636-8842
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.date.accessioned2021-10-25T17:29:12Z
dc.date.available2021-10-25T17:29:12Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30474
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8614695
dc.source.beginpage111
dc.source.conferenceIEEE International Electron Devices Meeting - IEDM
dc.source.conferencedate1/12/2018
dc.source.conferencelocationSan Fransisco, CA USA
dc.source.endpage114
dc.title

Interconnect metals beyond copper: reliability challenges and opportunities

dc.typeProceedings paper
dspace.entity.typePublication
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