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Highly-conformal plasma-enhanced atomic-layer deposition silicon dioxide liner for high aspect-ratio through-silicon via 3D interconnections
Publication:
Highly-conformal plasma-enhanced atomic-layer deposition silicon dioxide liner for high aspect-ratio through-silicon via 3D interconnections
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Date
2012
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Civale, Yann
;
Redolfi, Augusto
;
Velenis, Dimitrios
;
Heylen, Nancy
;
Beynet, Julien
;
Jung, Insoo
;
Woo, Jeong-Jun
;
Swinnen, Bart
;
Beyer, Gerald
;
Beyne, Eric
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1950
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Acq. date: 2025-12-12
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Views
1950
since deposited on 2021-10-20
1
last month
Acq. date: 2025-12-12
Citations