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Highly-conformal plasma-enhanced atomic-layer deposition silicon dioxide liner for high aspect-ratio through-silicon via 3D interconnections
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1947 since deposited on 2021-10-20
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Acq. date: 2025-10-24
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Views
1947 since deposited on 2021-10-20
434item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations