Publication:
3D system integration - opportunities and challenges
Date
| dc.contributor.author | Zhang, Wenqi | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-19T22:20:11Z | |
| dc.date.available | 2021-10-19T22:20:11Z | |
| dc.date.issued | 2011 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/20209 | |
| dc.source.conference | Advanced Packaging Technologies Consortium (APTC) Workshop | |
| dc.source.conferencedate | 14/03/2011 | |
| dc.source.conferencelocation | Shanghai China | |
| dc.title | 3D system integration - opportunities and challenges | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
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