Publication:

All wet strip approaches for post-etch photoresist layers after low-k patterning

Date

2007
Proceedings Paper
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dc.contributor.authorClaes, Martine
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorKesters, Els
dc.contributor.authorLux, Marcel
dc.contributor.authorUrionabarrenetxea, Ainara
dc.contributor.authorVereecke, Guy
dc.contributor.authorMertens, Paul
dc.contributor.authorCarleer, R.
dc.contributor.authorAdriaensens, P.
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorMertens, Paul
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.accessioned2021-10-16T15:19:10Z
dc.date.available2021-10-16T15:19:10Z
dc.date.embargo9999-12-31
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11872
dc.source.beginpage177
dc.source.conferenceCleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 10
dc.source.conferencedate7/10/2007
dc.source.conferencelocationWashington, DC USA
dc.source.endpage187
dc.title

All wet strip approaches for post-etch photoresist layers after low-k patterning

dc.typeProceedings paper
dspace.entity.typePublication
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