Publication:

Interposer technology for high band width interconnect applications

Date

2013
Proceedings Paper
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dc.contributor.authorDetalle, Mikael
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorNolmans, Philip
dc.contributor.authorDaily, Robert
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorNolmans, Philip
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-21T07:17:59Z
dc.date.available2021-10-21T07:17:59Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22257
dc.source.beginpage323
dc.source.conference63rd Electronic Components And Technology Conference - ECTC
dc.source.conferencedate28/05/2013
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage328
dc.title

Interposer technology for high band width interconnect applications

dc.typeProceedings paper
dspace.entity.typePublication
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