Publication:

The underfill-microbump interaction mechanism in 3D ICs: impact and mitigation of induced stresses

Date

2014
Proceedings Paper
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dc.contributor.authorIvankovic, Andrej
dc.contributor.authorCherman, Vladimir
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVandepitte, Dirk
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-22T02:15:58Z
dc.date.available2021-10-22T02:15:58Z
dc.date.embargo9999-12-31
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23992
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6813831&contentType=Conference+Publications
dc.source.beginpage1
dc.source.conference15th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE
dc.source.conferencedate6/04/2013
dc.source.conferencelocationGent Belgium
dc.source.endpage8
dc.title

The underfill-microbump interaction mechanism in 3D ICs: impact and mitigation of induced stresses

dc.typeProceedings paper
dspace.entity.typePublication
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