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Introduction to semiconductor packaging technology

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dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-16T15:04:59Z
dc.date.available2021-10-16T15:04:59Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11734
dc.source.conferenceTutorial, eCUBES - 3D Integrated Micro/Nano Modules for Easily Adapted Applications
dc.source.conferencedate4/09/2007
dc.source.conferencelocationUppsala Sweden
dc.title

Introduction to semiconductor packaging technology

dc.typeOral presentation
dspace.entity.typePublication
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