Publication:

Chip-package co-design of a 4.7 GHz VCO

Date

2000
Journal article
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dc.contributor.authorVaesen, Kristof
dc.contributor.authorDonnay, Stephane
dc.contributor.authorPieters, Philip
dc.contributor.authorCarchon, Geert
dc.contributor.authorDiels, Wim
dc.contributor.authorWambaq, P.
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.contributor.authorEngels, Marc
dc.contributor.authorBolsens, Ivo
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorDonnay, Stephane
dc.contributor.imecauthorPieters, Philip
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecDonnay, Stephane::0000-0003-2489-4793
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-14T13:55:34Z
dc.date.available2021-10-14T13:55:34Z
dc.date.embargo9999-12-31
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4800
dc.source.beginpage272
dc.source.endpage279
dc.source.issue3
dc.source.journalIMAPS International Journal of Microcircuits and Electronic Packaging
dc.source.volume23
dc.title

Chip-package co-design of a 4.7 GHz VCO

dc.typeJournal article
dspace.entity.typePublication
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