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Hybrid integration of multi-finger HEMTs: A comparison between flip-chip and substrate removal
Publication:
Hybrid integration of multi-finger HEMTs: A comparison between flip-chip and substrate removal
Date
2005
Presentation
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Das, Johan
;
Ruythooren, Wouter
;
Vandersmissen, Raf
;
Oprins, Herman
;
Derluyn, Joff
;
Germain, Marianne
;
Borghs, Gustaaf
Journal
Abstract
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1944
since deposited on 2021-10-16
Acq. date: 2025-10-24
Citations
Metrics
Views
1944
since deposited on 2021-10-16
Acq. date: 2025-10-24
Citations