Publication:

Cryoetching of silicon and advanced materials for 3D interconnects

Date

2014
Meeting abstract
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Author(s)

Dussart, R.
;
Tillocher, T.
;
Gosset, N
;
Lefaucheux, P.
;
L'jazouli, R
;
Boufnichel, M.
;
Zhang, Liping  
;
de Marneffe, Jean-Francois  
;
Baklanov, Mikhaïl
;
Nishimura, E
;
Yatsuda, K
;
Maekawa, K

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Abstract

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