Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies

dc.contributor.author	Vandevelde, Bart
dc.contributor.author	Beyne, Eric
dc.contributor.author	Vandepitte, D.
dc.contributor.author	Baelmans, M.
dc.contributor.imecauthor	Vandevelde, Bart
dc.contributor.imecauthor	Beyne, Eric
dc.contributor.orcidimec	Vandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimec	Beyne, Eric::0000-0002-3096-050X
dc.date.accessioned	2021-10-14T23:46:39Z
dc.date.available	2021-10-14T23:46:39Z
dc.date.issued	2002
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/6991
dc.source.beginpage	264
dc.source.endpage	278
dc.source.issue	3
dc.source.journal	International Journal of Microcircuits and Electronic Packaging
dc.source.volume	25
dc.title	Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies
dc.type	Journal article
dspace.entity.type	Publication
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