Publication:
3D system integration - mitigating the impact on CMOS devices
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-22T00:46:14Z | |
| dc.date.available | 2021-10-22T00:46:14Z | |
| dc.date.issued | 2014 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/23541 | |
| dc.source.conference | International Solid State Circuit Conference - ISSCC: Tutorial F2 "3D Stacking Technologies for Image Sensors and Memories" | |
| dc.source.conferencedate | 9/02/2014 | |
| dc.source.conferencelocation | San Francisco USA | |
| dc.title | 3D system integration - mitigating the impact on CMOS devices | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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