Publication:

Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints

Date

2023
Proceedings Paper
https://doi.org/10.1109/EuroSimE56861.2023.10100841
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dc.contributor.authorVandevelde, Bart
dc.contributor.authorLabie, Riet
dc.contributor.authorLauwaert, Ralph
dc.contributor.authorDudek, Rainer
dc.contributor.authorGromala, Przemyslaw
dc.contributor.authorEichorst, Michael
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLabie, Riet
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.date.accessioned2023-11-23T08:51:45Z
dc.date.available2023-10-15T17:21:19Z
dc.date.available2023-11-23T08:51:45Z
dc.date.issued2023
dc.description.wosFundingTextThis research is part of the European R&D&I EUREKA-PENTA project "HiPer" (High Performance Vehicle Computer and Communication System for Autonomous Driving), supported by industry association AENEAS and aiming to build on Europe's leading position in automotive AD for the future of road mobility. We would like to thank VLAIO, BMBF and PENTA for partially funding the HiPer project.
dc.identifier.doi10.1109/EuroSimE56861.2023.10100841
dc.identifier.eisbn979-8-3503-4597-1
dc.identifier.issn2833-8553
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42756
dc.publisherIEEE
dc.source.conference24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
dc.source.conferencedateAPR 16-19, 2023
dc.source.conferencelocationGraz
dc.source.journalna
dc.source.numberofpages8
dc.title

Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints

dc.typeProceedings paper
dspace.entity.typePublication
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