Publication:

Silicon photonic temperature sensor: from photonic integrated chip to fully packaged miniature probe

Date

2024-JAN 1
Journal article
https://doi.org/10.1117/1.JOM.4.1.011005
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cris.virtual.orcid0000-0002-6081-6867
cris.virtual.orcid0000-0001-8574-1235
cris.virtual.orcid0000-0002-3470-620X
cris.virtualsource.department96ad2c65-ac11-41e0-82fa-ba00518a3a8c
cris.virtualsource.department846d8fc0-f203-4ef5-be37-a5353cf001c3
cris.virtualsource.department9b42d0bc-60bf-45a2-a3b2-a257fa194a38
cris.virtualsource.orcid96ad2c65-ac11-41e0-82fa-ba00518a3a8c
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dc.contributor.authorMissinne, Jeroen
dc.contributor.authorGeudens, Viktor
dc.contributor.authorPoulopoulos, Giannis
dc.contributor.authorSzaj, Michal
dc.contributor.authorSyriopoulos, George
dc.contributor.authorZervos, Charalampos
dc.contributor.authorKyriazi, Evridiki
dc.contributor.authorAvramopoulos, Hercules
dc.contributor.authorVan Steenberge, Geert
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorGeudens, Viktor
dc.contributor.imecauthorVan Steenberge, Geert
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimecGeudens, Viktor::0000-0002-6081-6867
dc.contributor.orcidimecVan Steenberge, Geert::0000-0001-8574-1235
dc.date.accessioned2024-09-14T17:21:34Z
dc.date.available2024-09-14T17:21:34Z
dc.date.issued2024-JAN 1
dc.description.wosFundingTextThis work received funding from the European Union's Horizon 2020 innovation program (Grant No. 871875) (SEER).
dc.identifier.doi10.1117/1.JOM.4.1.011005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44493
dc.publisherSPIE-SOC PHOTO-OPTICAL INSTRUMENTATION ENGINEERS
dc.source.beginpage011005
dc.source.issue1
dc.source.journalJOURNAL OF OPTICAL MICROSYSTEMS
dc.source.numberofpages16
dc.source.volume4
dc.subject.keywordsMICROLENSES
dc.title

Silicon photonic temperature sensor: from photonic integrated chip to fully packaged miniature probe

dc.typeJournal article
dspace.entity.typePublication
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