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Flat package inductance extraction with ground plane current precalculation

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dc.contributor.authorLippens, Gunther
dc.contributor.authorDe Zutter, Daniel
dc.contributor.imecauthorDe Zutter, Daniel
dc.date.accessioned2021-10-14T17:16:20Z
dc.date.available2021-10-14T17:16:20Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5449
dc.source.beginpage221
dc.source.conferenceProceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - EPEP
dc.source.conferencedate29/10/2001
dc.source.conferencelocationCambridge, MA USA
dc.source.endpage224
dc.title

Flat package inductance extraction with ground plane current precalculation

dc.typeProceedings paper
dspace.entity.typePublication
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