Publication:

Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I

Date

2025
Editorial Material
https://doi.org/10.1109/JETCAS.2025.3600772
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-5058-8303
cris.virtualsource.department8a303854-e9b4-460a-b79d-03df3b3c4394
cris.virtualsource.orcid8a303854-e9b4-460a-b79d-03df3b3c4394
dc.contributor.authorHao, Qinfen
dc.contributor.authorChen, Kuan-Neng
dc.contributor.authorGoel, Sandeep Kumar
dc.contributor.authorLi, Hai
dc.contributor.authorMarinissen, Erik Jan
dc.date.accessioned2026-04-27T09:01:08Z
dc.date.available2026-04-27T09:01:08Z
dc.date.createdwos2025-09-27
dc.date.issued2025
dc.identifier.doi10.1109/JETCAS.2025.3600772
dc.identifier.issn2156-3357
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59199
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage362
dc.source.endpage367
dc.source.issue3
dc.source.journalIEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS
dc.source.numberofpages6
dc.source.volume15
dc.title

Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I

dc.typeEditorial material
dspace.entity.typePublication
imec.internal.crawledAt2025-10-22
imec.internal.sourcecrawler
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