Publication:
Confined IMCs for low temperature and high throughput D2W bonding
Date
| dc.contributor.author | Derakhshandeh, Jaber | |
| dc.contributor.author | La Tulipe, Douglas Charles | |
| dc.contributor.author | Capuz, Giovanni | |
| dc.contributor.author | Cherman, Vladimir | |
| dc.contributor.author | Gerets, Carine | |
| dc.contributor.author | Cochet, Tom | |
| dc.contributor.author | Shafahian, Ehsan | |
| dc.contributor.author | De Preter, Inge | |
| dc.contributor.author | Jamieson, Geraldine | |
| dc.contributor.author | Webers, Tomas | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Beyer, Gerald | |
| dc.contributor.author | Miller, Andy | |
| dc.contributor.imecauthor | Derakhshandeh, Jaber | |
| dc.contributor.imecauthor | La Tulipe, Douglas Charles | |
| dc.contributor.imecauthor | Capuz, Giovanni | |
| dc.contributor.imecauthor | Cherman, Vladimir | |
| dc.contributor.imecauthor | Gerets, Carine | |
| dc.contributor.imecauthor | Cochet, Tom | |
| dc.contributor.imecauthor | Shafahian, Ehsan | |
| dc.contributor.imecauthor | De Preter, Inge | |
| dc.contributor.imecauthor | Jamieson, Geraldine | |
| dc.contributor.imecauthor | Webers, Tomas | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Beyer, Gerald | |
| dc.contributor.imecauthor | Miller, Andy | |
| dc.contributor.orcidimec | Derakhshandeh, Jaber::0000-0003-2448-9165 | |
| dc.contributor.orcidimec | Capuz, Giovanni::0000-0002-5263-4836 | |
| dc.contributor.orcidimec | Cherman, Vladimir::0000-0002-8068-9236 | |
| dc.contributor.orcidimec | Shafahian, Ehsan::0000-0001-6125-5793 | |
| dc.contributor.orcidimec | Jamieson, Geraldine::0000-0002-6750-097X | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | Miller, Andy::0000-0001-7048-2242 | |
| dc.contributor.orcidimec | Gerets, Carine::0009-0007-2069-6032 | |
| dc.contributor.orcidimec | Beyer, Gerald::0009-0001-0376-866X | |
| dc.date.accessioned | 2023-02-23T12:32:02Z | |
| dc.date.available | 2022-09-22T02:50:27Z | |
| dc.date.available | 2023-02-23T12:32:02Z | |
| dc.date.issued | 2022 | |
| dc.description.wosFundingText | Authors would like to acknowledge IMEC p-line for their support of processing and bonding tests. | |
| dc.identifier.eisbn | 978-4-9911911-3-8 | |
| dc.identifier.issn | na | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40473 | |
| dc.publisher | IEEE | |
| dc.source.beginpage | 131 | |
| dc.source.conference | International Conference on Electronics Packaging (ICEP) | |
| dc.source.conferencedate | MAY 11-14, 2022 | |
| dc.source.conferencelocation | Sapporo | |
| dc.source.endpage | 132 | |
| dc.source.journal | na | |
| dc.source.numberofpages | 2 | |
| dc.title | Confined IMCs for low temperature and high throughput D2W bonding | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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