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A practical approach to thermal modeling and validation of 3D-ICs
Publication:
A practical approach to thermal modeling and validation of 3D-ICs
Date
2010
Meeting abstract
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20172.pdf
747.41 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Cupak, Miroslav
;
Oprins, Herman
;
Van der Plas, Geert
;
Marchal, Pol
;
Vandevelde, Bart
;
Srinivasan, Adi
;
Cheng, Edmund
Journal
Abstract
Description
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Views
1965
since deposited on 2021-10-18
418
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations
Metrics
Views
1965
since deposited on 2021-10-18
418
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations