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A practical approach to thermal modeling and validation of 3D-ICs
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A practical approach to thermal modeling and validation of 3D-ICs
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Date
2010
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20172.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Cupak, Miroslav
;
Oprins, Herman
;
Van der Plas, Geert
;
Marchal, Pol
;
Vandevelde, Bart
;
Srinivasan, Adi
;
Cheng, Edmund
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1966
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Acq. date: 2025-12-10
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Views
1966
since deposited on 2021-10-18
1
last month
1
last week
Acq. date: 2025-12-10
Citations