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Conference contributions
Direct Au and Cu wire bonding on Cu/Low-k BEOL
Publication:
Direct Au and Cu wire bonding on Cu/Low-k BEOL
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Date
2002
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Banda, Pedro
;
Ho, Meng
;
Whelan, Caroline
;
Lam, Kan Wai
;
Vath, C.J.
;
Beyne, Eric
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Abstract
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1922
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Acq. date: 2025-12-09
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Views
1922
since deposited on 2021-10-14
2
last month
2
last week
Acq. date: 2025-12-09
Citations