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Conference contributions
Thermal aspects of 3D and 2.5D system integration
Publication:
Thermal aspects of 3D and 2.5D system integration
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Date
2017-01
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Oprins, Herman
;
Cherman, Vladimir
;
Van der Plas, Geert
;
Beyne, Eric
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1799
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Acq. date: 2025-12-15
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Views
1799
since deposited on 2021-10-24
2
last month
Acq. date: 2025-12-15
Citations