Publication:
Tape-assisted fusion bonding for wafers with through Si holes
Date
| dc.contributor.author | Stassen, Andim | |
| dc.contributor.author | Visker, Jakob | |
| dc.contributor.author | Andrei, Alexandru | |
| dc.contributor.author | Fondu, Jelle | |
| dc.contributor.imecauthor | Stassen, Andim | |
| dc.contributor.imecauthor | Visker, Jakob | |
| dc.contributor.imecauthor | Andrei, Alexandru | |
| dc.contributor.imecauthor | Fondu, Jelle | |
| dc.contributor.orcidimec | Stassen, Andim::0000-0001-8819-9592 | |
| dc.date.accessioned | 2021-10-24T14:10:09Z | |
| dc.date.available | 2021-10-24T14:10:09Z | |
| dc.date.issued | 2017 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/29497 | |
| dc.source.conference | The International Conference on Wafer Bonding - WAFERBOND | |
| dc.source.conferencedate | 27/11/2017 | |
| dc.source.conferencelocation | Leuven Belgium | |
| dc.title | Tape-assisted fusion bonding for wafers with through Si holes | |
| dc.type | Meeting abstract | |
| dspace.entity.type | Publication | |
| Files | ||
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