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Improvement in post-Chemical Mechanical Planarization cleaning process for Ru interconnects
Publication:
Improvement in post-Chemical Mechanical Planarization cleaning process for Ru interconnects
Date
2019
Presentation
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Harada, Ken
;
Shibata, Toshiaki
;
Kawase, Yasuhiro
;
Teugels, Lieve
;
Heylen, Nancy
;
Struyf, Herbert
Journal
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1938
since deposited on 2021-10-27
Acq. date: 2025-10-26
Citations
Metrics
Views
1938
since deposited on 2021-10-27
Acq. date: 2025-10-26
Citations