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Study on Next-Generation EUV Lithography Technology: Hyper NA, the Highest Potential for Practical Implementation

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dc.contributor.authorLee, Inhwan
dc.contributor.authorFranke, Joern-Holger
dc.contributor.authorPhilipsen, Vicky
dc.contributor.authorRonse, Kurt
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorHendrickx, Eric
dc.contributor.imecauthorLee, Inhwan
dc.contributor.imecauthorFranke, Joern-Holger
dc.contributor.imecauthorPhilipsen, Vicky
dc.contributor.imecauthorRonse, Kurt
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.imecauthorHendrickx, Eric
dc.contributor.orcidimecLee, Inhwan::0000-0002-3283-5075
dc.contributor.orcidimecFranke, Joern-Holger::0000-0002-3571-1633
dc.contributor.orcidimecPhilipsen, Vicky::0000-0002-2959-432X
dc.contributor.orcidimecRonse, Kurt::0000-0003-0803-4267
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.contributor.orcidimecHendrickx, Eric::0000-0003-2516-0417
dc.date.accessioned2025-08-28T03:56:51Z
dc.date.available2025-08-28T03:56:51Z
dc.date.issued2025-AUG 11
dc.description.wosFundingTextThe authors gratefully acknowledge the contributions of all members of imec imaging and reticle team, especially, Peter de Bisschop for valuable discussions, and Gerardo Bottiglieri from ASML, Jens-Timo Neumann, Michael Patra, and Joerg Zimmermann from Zeiss for valuable discussions and support in this work, and Ulrich Klostermann, Ulrich Welling from Synopsys for sharing resist modeling and discussions. We used S-Litho EUV of Synopsys and Hyperlith of Panoramic Technology for simulation works.
dc.identifier.doi10.1021/acsami.5c11891
dc.identifier.issn1944-8244
dc.identifier.pmidMEDLINE:40785079
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/46124
dc.publisherAmerican Chemical Society
dc.source.beginpage47719
dc.source.endpage47735
dc.source.issue17
dc.source.journalACS APPLIED MATERIALS & INTERFACES
dc.source.numberofpages17
dc.source.volume33
dc.subject.keywordsMULTILAYER MIRRORS
dc.subject.keywordsLA/B
dc.title

Study on Next-Generation EUV Lithography Technology: Hyper NA, the Highest Potential for Practical Implementation

dc.typeJournal article
dspace.entity.typePublication
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