Publication:
TSV characterization and modeling
Date
| dc.contributor.author | Stucchi, Michele | |
| dc.contributor.author | Katti, Guruprasad | |
| dc.contributor.author | Velenis, Dimitrios | |
| dc.contributor.imecauthor | Stucchi, Michele | |
| dc.contributor.imecauthor | Velenis, Dimitrios | |
| dc.date.accessioned | 2021-10-19T19:20:20Z | |
| dc.date.available | 2021-10-19T19:20:20Z | |
| dc.date.issued | 2011 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/19846 | |
| dc.source.beginpage | 33 | |
| dc.source.book | Three Dimensional System Integration, IC Stacking Process and Design | |
| dc.source.endpage | 49 | |
| dc.title | TSV characterization and modeling | |
| dc.type | Book chapter | |
| dspace.entity.type | Publication | |
| Files | ||
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