Publication:
3D Chips: stacked 2D, or a chance to make smarter designs?
Date
| dc.contributor.author | Provoost, Jan | |
| dc.contributor.imecauthor | Provoost, Jan | |
| dc.date.accessioned | 2021-10-18T20:34:33Z | |
| dc.date.available | 2021-10-18T20:34:33Z | |
| dc.date.issued | 2010 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/17845 | |
| dc.identifier.url | http://www.meptec.org/Resources/MEPTEC%20Report%2014.3.pdf | |
| dc.source.beginpage | 12 | |
| dc.source.issue | 3 | |
| dc.source.journal | MEPTEC Report | |
| dc.source.volume | 14 | |
| dc.title | 3D Chips: stacked 2D, or a chance to make smarter designs? | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |