Publication:
Thermal and thermo-mechanical evaluation of a 'chip in moulded interconnect device'
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1957 since deposited on 2021-09-30
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Acq. date: 2026-02-27
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Statistics
Views
1957 since deposited on 2021-09-30
3last month
2last week
Acq. date: 2026-02-27
Citations