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Conference contributions
Thermal and thermo-mechanical evaluation of a 'chip in moulded interconnect device'
Publication:
Thermal and thermo-mechanical evaluation of a 'chip in moulded interconnect device'
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Date
1997
Proceedings Paper
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526.pdf
2.47 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Christiaens, Filip
;
Beyne, Eric
;
Roggen, Jean
;
Van Puymbroeck, Jan
;
Heerman, M.
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Abstract
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1954
since deposited on 2021-09-30
Acq. date: 2025-12-09
Citations
Metrics
Views
1954
since deposited on 2021-09-30
Acq. date: 2025-12-09
Citations