3D Multifunctional composites based on large-area stretchable circuit with thermoforming technology

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Author(s)

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Vervust, Thomas

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Van Put, Steven

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Vandecasteele, Bjorn

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Dhaenens, Kristof

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Degrendele, Lieven

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De Vriese, Linde

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Kaufmann, Markus

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Sekitiani, Tsyoshi

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Vanfleteren, Jan

Journal

Advanced Electronic Materials

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1986 since deposited on 2021-10-26

Acq. date: 2025-10-28