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Reduction of plasma induced damage of porous low-k materials using a cryogenic etching process

Date

2015
Proceedings Paper
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dc.contributor.authorTillocher, T.
dc.contributor.authorLeroy, F.
dc.contributor.authorZhang, Liping
dc.contributor.authorLefaucheux, P.
dc.contributor.authorYatsuda, K.
dc.contributor.authorMaekawa, K.
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorDussart, R.
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.date.accessioned2021-10-22T23:33:49Z
dc.date.available2021-10-22T23:33:49Z
dc.date.embargo9999-12-31
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25995
dc.source.beginpageO-8-1
dc.source.conference22nd International Symposium on Plasma Chemistry - ISPC
dc.source.conferencedate5/07/2015
dc.source.conferencelocationAntwerpen Belgium
dc.title

Reduction of plasma induced damage of porous low-k materials using a cryogenic etching process

dc.typeProceedings paper
dspace.entity.typePublication
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