Publication:

Reliability characteristics of thin porous low-k silica-based interconnect dielectrics

Date

2013
Proceedings Paper
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dc.contributor.authorBarbarin, Yohan
dc.contributor.authorCroes, Kristof
dc.contributor.authorRoussel, Philippe
dc.contributor.authorLi, Yunlong
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorTokei, Zsolt
dc.contributor.authorZhao, Larry
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.date.accessioned2021-10-21T06:44:30Z
dc.date.available2021-10-21T06:44:30Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22017
dc.source.beginpage2F.3
dc.source.conferenceIEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate14/04/2013
dc.source.conferencelocationMonterey, CA USA
dc.title

Reliability characteristics of thin porous low-k silica-based interconnect dielectrics

dc.typeProceedings paper
dspace.entity.typePublication
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