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Conference contributions
Void detection in copper interconnects using Energy Dispersive X-Ray Spectroscopy
Publication:
Void detection in copper interconnects using Energy Dispersive X-Ray Spectroscopy
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Date
2011
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22801.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Tsigkourakos, Menelaos
;
Hantschel, Thomas
;
Franquet, Alexis
;
Conard, Thierry
;
Carbonell, Laure
;
Vandervorst, Wilfried
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1911
since deposited on 2021-10-19
Acq. date: 2025-12-15
Citations
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Views
1911
since deposited on 2021-10-19
Acq. date: 2025-12-15
Citations