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A high-speed heterogeneous lithium tantalate silicon photonics platform

 
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dc.contributor.authorNiels, Margot
dc.contributor.authorVanackere, Tom
dc.contributor.authorVissers, Ewoud
dc.contributor.authorZhai, Tingting
dc.contributor.authorNenezic, Patrick
dc.contributor.authorDeclercq, Jakob
dc.contributor.authorBruynsteen, Cedric
dc.contributor.authorNiu, Shengpu
dc.contributor.authorMoerman, Arno
dc.contributor.authorCaytan, Olivier
dc.contributor.authorSingh, Nishant
dc.contributor.authorLemey, Sam
dc.contributor.authorYin, Xin
dc.contributor.authorJanssen, Sofie
dc.contributor.authorVerheyen, Peter
dc.contributor.authorSingh, Neha
dc.contributor.authorBode, Dieter
dc.contributor.authorDavi, Martin
dc.contributor.authorFerraro, Filippo
dc.contributor.authorAbsil, Philippe
dc.date.accessioned2026-05-28T09:57:07Z
dc.date.available2026-05-28T09:57:07Z
dc.date.createdwos2026-01-17
dc.date.issued2026
dc.description.abstractThe rapid expansion of cloud computing and artificial intelligence has driven the demand for faster optical components in data centres to unprecedented levels. A key advancement in this field is the integration of multiple photonic components onto a single chip, enhancing the performance of optical transceivers. Here silicon photonics, benefiting from mature fabrication processes, has gained prominence in both academic research and industrial applications. The platform combines modulators, switches, photodetectors and low-loss waveguides on a single chip. However, emerging telecommunication standards require modulation speeds that exceed the capabilities of silicon-based modulators. To address these limitations, thin-film lithium niobate has been proposed as an alternative to silicon photonics, offering a low voltage–length product and exceptional high-speed modulation properties. More recently, the first demonstrations of thin-film lithium tantalate circuits have emerged, potentially addressing some of the disadvantages of lithium niobate, enabling a reduced bias drift and enhanced resistance to optical damage. As such, this material arises as a promising candidate for next-generation photonic platforms. However, a persistent drawback of such platforms is the lithium contamination, which complicates integration with CMOS fabrication processes. Here we present for the first time the integration of lithium tantalate onto a silicon photonics chip. This integration is achieved without modifying the standard silicon photonics process design kit. Our device achieves low half-wave voltage (3.5 V), low insertion loss (2.9 dB) and high-speed operation (>70 GHz), paving the way for next-generation applications. By minimizing lithium tantalate material use, our approach reduces costs while leveraging existing silicon photonics technology advancements, in particular supporting ultra-fast monolithic germanium photodetectors and established process design kits.
dc.description.wosFundingTextWe would like to acknowledge the contribution of imec's 200 mm pilot line for silicon photonics wafer fabrication and imec's PDK team for the mask tape-out. We also would like to acknowledge the contribution from P. Eswaran and S. Culhaoglu for the help in Si-PIC process development; S. Verstuyft, P. Geerinck, E. Ozceri and L. Van Landschoot for the help during the lithium tantalate device fabrication; and C. Kruckel and J. Van Kerrebrouck for measurement support. Micro-transfer printing (mu TP) is a technology under licence from X-Celeprint. We want to thank the European Space Agency for funding under the E/0365-70-NAVISP, LEO Project and the Research Foundation Flanders (FWO) for projects 3G035722 and 3F025420 and the FWO and F.R.S.-FNRS under the Excellence of Science (EOS) programme (40007560).
dc.identifier.doi10.1038/s41566-025-01832-9
dc.identifier.issn1749-4885
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59466
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherNATURE PORTFOLIO
dc.source.beginpage225
dc.source.endpage231
dc.source.issue2
dc.source.journalNATURE PHOTONICS
dc.source.numberofpages17
dc.source.volume20
dc.subject.keywordsMACH-ZEHNDER MODULATOR
dc.subject.keywordsINTEGRATED PHOTONICS
dc.title

A high-speed heterogeneous lithium tantalate silicon photonics platform

dc.typeJournal article
dspace.entity.typePublication
imec.internal.crawledAt2026-04-07
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-04-07
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