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Thermal performance comparison of advanced 3D packages for mobile applications
Publication:
Thermal performance comparison of advanced 3D packages for mobile applications
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Date
2018
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Oprins, Herman
;
Cherman, Vladimir
;
Beyne, Eric
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1818
since deposited on 2021-10-26
Acq. date: 2026-08-31
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Views
1818
since deposited on 2021-10-26
Acq. date: 2026-08-31
Citations