Publication:

Effect on thermal fatigue reliability of decreasing the pitch of PSGA packages from 0.8 to 0.3 mm

Date

1999
Presentation
Simple item page Full metadata Statistics
 
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Puymbroeck, Jan
dc.contributor.authorHeerman, M.
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Puymbroeck, Jan
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-14T11:51:17Z
dc.date.available2021-10-14T11:51:17Z
dc.date.embargo9999-12-31
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3967
dc.source.conferenceArea Array Packaging Technologies Workshop
dc.source.conferencedate15/11/1999
dc.source.conferencelocationBerlin Germany
dc.title

Effect on thermal fatigue reliability of decreasing the pitch of PSGA packages from 0.8 to 0.3 mm

dc.typeOral presentation
dspace.entity.typePublication
Files

Original bundle

Name:
3936.pdf
Size:
1.04 MB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Presentations