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Evaluation of photosensitive spin-on-dielectrics for 3-D wafer level packaging
Publication:
Evaluation of photosensitive spin-on-dielectrics for 3-D wafer level packaging
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Date
2010
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Duval, Fabrice
;
Soussan, Philippe
;
Miller, Andy
;
De Raedt, Walter
;
Sun, Xiao
;
Beyne, Eric
;
Okoro, Chukwudi
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1962
since deposited on 2021-10-18
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last month
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last week
Acq. date: 2025-12-11
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Metrics
Views
1962
since deposited on 2021-10-18
1
last month
1
last week
Acq. date: 2025-12-11
Citations