Publication:

Influence of wafer-to-wafer bond alignment on via-last patterning for 3DSOC applications

Date

2017
Meeting abstract
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dc.contributor.authorDe Vos, Joeri
dc.contributor.authorPeng, Lan
dc.contributor.authorVan Ongeval, Joost
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorKurz, Florian
dc.contributor.authorWagenleiter, Thomas
dc.contributor.authorWimplinger, Markus
dc.contributor.authorUhrmann, Thomas
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorVan Ongeval, Joost
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-24T04:00:03Z
dc.date.available2021-10-24T04:00:03Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28174
dc.source.conferenceThe International Conference on Wafer Bonding - Waferbond
dc.source.conferencedate27/11/2017
dc.source.conferencelocationLeuven Belgium
dc.title

Influence of wafer-to-wafer bond alignment on via-last patterning for 3DSOC applications

dc.typeMeeting abstract
dspace.entity.typePublication
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