Publication:
Thermo-mechanical FEM analysis of lead free and lead containing solder for flip chip applications
Date
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Vanfleteren, Jan | |
| dc.contributor.author | Manessis, Dionysios | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.imecauthor | Vanfleteren, Jan | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.contributor.orcidimec | Vanfleteren, Jan::0000-0002-9654-7304 | |
| dc.date.accessioned | 2021-10-16T01:45:22Z | |
| dc.date.available | 2021-10-16T01:45:22Z | |
| dc.date.issued | 2005-06 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/10505 | |
| dc.source.beginpage | 440 | |
| dc.source.conference | Proceedings 15th European Microelectronics and Packaging Conference & Exhibition - IMAPS | |
| dc.source.conferencedate | 12/06/2005 | |
| dc.source.conferencelocation | Brugge Belgium | |
| dc.source.endpage | 445 | |
| dc.title | Thermo-mechanical FEM analysis of lead free and lead containing solder for flip chip applications | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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