Publication:

Chiplet Interconnect Repair for Clustered Defects with Minimal Propagation Delay

 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-5058-8303
cris.virtual.orcid0000-0001-7325-8836
cris.virtualsource.department8a303854-e9b4-460a-b79d-03df3b3c4394
cris.virtualsource.department52be9e5e-be21-4e16-bad5-1335c497e6fd
cris.virtualsource.orcid8a303854-e9b4-460a-b79d-03df3b3c4394
cris.virtualsource.orcid52be9e5e-be21-4e16-bad5-1335c497e6fd
dc.contributor.authorChuang, Po-Yao
dc.contributor.authorMarinissen, Erik Jan
dc.date.accessioned2026-06-08T11:07:19Z
dc.date.available2026-06-08T11:07:19Z
dc.date.issued2025
dc.identifier.doi10.1109/ats66998.2025.00021
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59626
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.source.beginpage73
dc.source.endpage78
dc.source.journal2025 IEEE 34th Asian Test Symposium (ATS)
dc.title

Chiplet Interconnect Repair for Clustered Defects with Minimal Propagation Delay

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2026-04-24
imec.internal.sourcecrawler
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