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YOLOv8 for Defect Inspection of Hexagonal Directed Self-Assembly Patterns: A Data-Centric Approach

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cris.virtual.orcid0000-0002-6314-2685
cris.virtual.orcid0000-0003-3775-3578
cris.virtual.orcid0000-0003-4370-5062
cris.virtual.orcid0000-0001-9021-2469
cris.virtual.orcid0000-0002-0886-137X
cris.virtual.orcid0000-0002-3679-811X
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cris.virtualsource.department618c7dcf-d19e-467b-8ef0-ea4d90b44eb8
cris.virtualsource.department9be55e2a-6005-4422-934e-fb2f4424fb1c
cris.virtualsource.orcid1fc7b9f7-9367-45d8-be12-90bcb20ebcbd
cris.virtualsource.orcid1fd77399-4d0a-4004-8a7f-9634c67c90de
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cris.virtualsource.orcid9be55e2a-6005-4422-934e-fb2f4424fb1c
dc.contributor.authorDehaerne, Enrique
dc.contributor.authorDey, Bappaditya
dc.contributor.authorEsfandiar, Hossein
dc.contributor.authorVerstraete, Lander
dc.contributor.authorSuh, Hyo Seon
dc.contributor.authorHalder, Sandip
dc.contributor.authorDe Gendt, Stefan
dc.date.accessioned2026-05-04T12:31:45Z
dc.date.available2026-05-04T12:31:45Z
dc.date.createdwos2026-03-27
dc.date.issued2023
dc.description.abstractShrinking pattern dimensions leads to an increased variety of defect types in semiconductor devices. This has spurred innovation in patterning approaches such as Directed Self-Assembly (DSA) for which no traditional, automatic defect inspection software exists. Machine Learning-based SEM image analysis has become an increasingly popular research topic for defect inspection with supervised ML models often showing the best performance. However, little research has been done on obtaining a dataset with high-quality labels for these supervised models. In this work, we propose a method for obtaining coherent and complete labels for a dataset of hexagonal contact hole DSA patterns while requiring minimal quality control effort from a DSA expert. We show that YOLOv8, a state-of-the-art neural network, achieves defect detection precisions of more than 0.9 mAP on our final dataset which best reflects DSA expert defect labeling expectations. We discuss the strengths and limitations of our proposed labeling approach and suggest directions for future work in data-centric ML-based defect inspection.
dc.identifier.doi10.1117/12.2675573
dc.identifier.isbn978-1-5106-6860-7
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59292
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING
dc.source.beginpage128020S
dc.source.conference38th European Mask and Lithography Conference - EMLC
dc.source.conferencedate2023-06-19
dc.source.conferencelocationDresden
dc.source.journal38TH EUROPEAN MASK AND LITHOGRAPHY CONFERENCE, EMLC 2023
dc.source.numberofpages14
dc.subject.keywordsCLASSIFICATION
dc.title

YOLOv8 for Defect Inspection of Hexagonal Directed Self-Assembly Patterns: A Data-Centric Approach

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2026-03-30
imec.internal.sourcecrawler
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