Publication:

Three-Dimensional Modeling of BEOL TDDB: Variability Specs for Sub-20 nm Half-Pitch Interconnects

Date

2025-APR 7
Journal article
https://doi.org/10.1109/TED.2025.3554474
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dc.contributor.authorFang, Yu
dc.contributor.authorCiofi, I.
dc.contributor.authorRoussel, Ph. J.
dc.contributor.authorLesniewska, A.
dc.contributor.authorCarballo, V. M. Blanco
dc.contributor.authorDegraeve, R.
dc.contributor.authorWolf, I. De
dc.contributor.authorCroes, K.
dc.contributor.imecauthorCiofi, I.
dc.contributor.imecauthorRoussel, Ph. J.
dc.contributor.imecauthorLesniewska, A.
dc.contributor.imecauthorCarballo, V. M. Blanco
dc.contributor.imecauthorDegraeve, R.
dc.contributor.imecauthorCroes, K.
dc.date.accessioned2025-05-01T06:24:42Z
dc.date.available2025-05-01T06:24:42Z
dc.date.issued2025-APR 7
dc.description.wosFundingTextThis work was supported by imec.
dc.identifier.doi10.1109/TED.2025.3554474
dc.identifier.issn0018-9383
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45574
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.journalIEEE TRANSACTIONS ON ELECTRON DEVICES
dc.source.numberofpages8
dc.subject.keywordsCHALLENGES
dc.title

Three-Dimensional Modeling of BEOL TDDB: Variability Specs for Sub-20 nm Half-Pitch Interconnects

dc.typeJournal article
dspace.entity.typePublication
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